Hlava - Dewalt D21510 - Stry 1,81KG č. 800 Kód: 429698-00

4PCS Universal BGA Stencil For MTK MSM Huawei Xiaomi IPad CPU RAM PM Power IC Reball Pin BGA Direct Heat Template Ҳģ.detail-extend{ max-width: 984px; width: 100%; margin:0 auto; } .detail-extend .product_c{ margin:30px 0; } .detail-extend .product-title{ position: relative; border-bottom: 1px solid #ddd; padding-bottom: 5px; text-align: center; font-family: Open Sans,Arial,Helvetica,sans-serif,Heiti; font-size: 20px; font-weight: bold; } .detail-extend .product-title:after{ content: ""; position: absolute; width: 60px; height: 3px; background: #000; bottom: -2px; left: 50%; margin-left: -30px; } .detail-extend img{ display: block; text-align: center; margin: 25px auto; }Features:*These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.*Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use.*High success rate of planting tin, the solder balls can be formed once when you are proficient.*Simple and convenient to use.*BGA Reballing Stencil only, other accessories demo in the picture is not included!Specifications:Product name: BGA Reballing StencilMaterial: Stainless steelColor: SilverSize: Standard SizeSuitable for: Reballing the BGA ICQuantity: 4Pcs SetPackage Included:4 x Trim Removal ToolsNote:1.Transition: 1cm=10mm=0.39inch.2. The real color of the item may be slightly different from the pictures shown on website caused by many factors such as brightness of your monitor and light brightness.3. Please allow slight manual measurement deviation for the data.